Ishishini le-semiconductor lixhomekeke kakhulu kwizixhobo ezenziwe ngokukodwa ezifuna ukuchaneka okugqithisileyo, iijometri ezintsonkothileyo, kunye nemigangatho engqongqo yokusebenza—iimfuno apho i-CNC machining igqwesa khona. Njengenkokeli ethembekileyo kwimveliso echanekileyo, i-HLW igxile kwi-CNC machining yezixhobo ze-semiconductor ezenziwe ngokukodwa, isebenzisa amashumi eminyaka obuchule, iitekhnoloji eziphucukileyo, kunye nolawulo olungqongqo lomgangatho ukuhlangabezana neemfuno eziguqukayo zeli candelo likhula ngokukhawuleza. Ukususela kwimveliso yovavanyo ukuya kwimveliso eninzi, i-HLW ibonelela ngezisombululo ezenzelwe wena ezithobela imigangatho engqongqo yokunyamezela kunye nemithetho yeshishini, ixhasa izicelo ezibalulekileyo kuyo yonke into ye-elektroniki, yezonyango, Isithuba-mkhathi, ukhuselo, kunye nemimandla yamandla ahlaziyekayo.
Amandla aphambili okusila
I-HLW isebenzisa iindidi ezahlukeneyo zobuchwepheshe bokwenziwa kwe-CNC ukujongana nemingeni ekhethekileyo yokuveliswa kwezixhobo ze-semiconductor. Izakhono eziphambili ziquka:
- Ukugaya nge-CNC Nye UkujikaUkugaya okuchanekileyo okuthe nkqo nokwama-axis amaninzi (kuquka ukusebenza nge-5-axis) kwezixhobo ezintsonkothileyo, ezifuna ukuchaneka okungqongqo, kuqinisekiswa ukuthe tyaba, ukuchaneka kobungakanani, kunye neejometri ezintsonkothileyo. Ukujika nge-CNC kusetyenziselwa izixhobo eziyisilinda, kugcinwa ukujikeleza okugqwesileyo, ukuba yisilinda, kunye nokugqitywa komphezulu.
- Ukwenziwa Kwezixhobo Ngokukhethekileyo: Ukuzenzela iinxalenye ezincinci ezineenkcukacha eziphezulu ngomatshini we-CNC waseSwitzerland, okufuna ukuchaneka okugqwesileyo; ukuzenzela iinxalenye ngomatshini wokukhupha umbane (Umculo we-elektroniki wamandla), kuquka i-wire EDM kunye ne-RAM EDM, yokusika ngokuchanekileyo izinto eziqinileyo okanye ezingaqhelekanga ngaphandle koxinzelelo olugqithisileyo; kunye neenkqubo ezifana nokulapha, ukugaya, kunye nokuncamathisela ukuze kugqityezelwe nokudityaniswa.
- Uyilo Oluphucukileyo Nokuveliswa Kwezinto Ezivavanywayo: Ukwenziwa kwemifuziselo ye-CAD/CAM nokudityaniswa kweefayile ze-3D CAD ukuguqula iidizayini zedijithali zibe ngamacandelo anokuphathwa, nto leyo eyenza ukuba kubekho uvavanyo lokuhambelana phambi kokuveliswa. I-HLW ixhasa ukwenza iiprototypes ngokukhawuleza, ukuveliswa kwemveliso enomthamo ophantsi, kunye nokuveliswa kwemveliso enomthamo ophezulu, inokuguquguquka ekwandiseni iiprojekthi ngokusekelwe kwiimfuno zeklayenti.
- Izisombululo ze-Multi-Axis nezizenzekelayoOomatshini be-CNC be-multi-axis bophucuko oluphezulu (kuquka izixhobo ze-HAAS) bezakhiwo ezintsonkothileyo kunye nemveliso engabizi kakhulu, bexhaswa lulawulo lweeprojekthi oluncediswa yi-AI kunye neenkqubo ezizenzekelayo ukunciphisa impazamo yomntu nokuphucula ukusebenza kakuhle.
Izinto Zokwakha Nezixhobo Ezenziwe Ngokweemfuno
I-HLW isebenza ngeentlobo ngeentlobo zezinto ezilungiselelwe ukusetyenziswa kwiisemi-conductor, iqinisekisa ukungangeni-mngeni kwiimeko ze-elektroniki ezibuthathaka kunye neemfuno zokusebenza:
- Iintsimbi nee-alloyi: Isilicon, ijermeneyeyamu, I-aluminiyam, Ikoporo, imolibdenam, ititaniyam, intsimbi engatyiwayo, kunye ne-alloys ezinetshokhwe ephezulu, kwakunye nezinto ze-ceramic ezifana ne-aluminium nitride kunye ne-silicon nitride—ezikhethelwe ukukwazi kwazo ukuhambisa ubushushu, amandla oomatshini, kunye nokumelana nomhlwa.
- Iiplastiki zobunjineli: I-Delrin, i-Ultem, i-G-10, i-Teflon, kunye ne-PEEK, ezilungele iinxalenye ezilula nezisebenza kakhulu kwiinkqubo ze-semiconductor.
Iinxalenye ezenziwe ngokweemfuno ze-HLW ziquka abathwali be-wafer, iinxalenye zegumbi, izikhululi zokushisa, izixhobo zokuphatha i-wafer, iigaskets, izitywini, izikhuseli, iitshiphu zekhompyutha, ii-electromagnetic wafer chucks, iipleyiti zokwabela igesi, izomisi ze-flexible circuit, izikhongozeli zeenxalenye ze-microwave/radiowave, kunye nezidibanisi ezinokunyamezela okungqongqo. Ezi nxalenye ziyilelwe ukuhlangabezana neemfuno zokwenziwa zibe ncinci, ubunzima, kunye nokuthembeka kweetekhnoloji zanamhlanje ze-semiconductor.
Uqinisekiso loMgangatho neziQinisekiso
Umgangatho uphambili kwimveliso yeesemiconductor, apho neyona mpazamo incinci inokukhokelela ekusileleni kwezixhobo. I-HLW igcina iinkqubo ezingqongqo zolawulo lomgangatho, eziquka uhlolo olungqongqo lobungakanani, uhlalutyo lomphezulu, uvavanyo olunamanqanaba amaninzi, kunye neenkqubo zokufumana iimpazamo ukuqinisekisa izixhobo ezingenampazamo. Le nkampani inezatifikethi ezikhokelayo kushishino ezifana ne-AS9100 (kuquka i-Rev. D), i-ISO 9001, kunye nobhaliso lwe-ITAR, nto leyo ebonisa ukuthotyelwa kwemigangatho yehlabathi yokuchaneka, ukhuseleko, kunye nokulandeleka. Ukuzinikela kwe-HLW kumgangatho ophezulu kubonakala kumazinga ayo aphantsi okwaliwa kunye nokuzinikela kwayo ekufezekiseni imilinganiselo engqongqo—idla ngokuba yi-±0.002″ kubunxweme nokungqamana.
Izicelo Nenkxaso Yecandelo Lomsebenzi
Iinxalenye ze-semiconductor ezenzelweyo ze-HLW zinika amandla iinkqubo ezininzi ezahlukeneyo kumashishini ahlukeneyo:
- Izixhobo zombaneIisekethe ezimanyeneyo, iitshiphu zekhompyutha, kunye namacandelo e-elektroniki achaneke kakhulu.
- EzokwelaphaIzixhobo zotyando, izixhobo ezifakelwayo, kunye nezivamvo zokhathalelo lwempilo.
- I-Aerospace noKhuselo: Ithekhinoloji yerada, iinxalenye zeenqwelomoya, kunye nezixhobo zombane zokhuselo.
- Amandla ahlaziyekayoIiphotovoltaics kunye namacandelo enkqubo yamandla.
- Ubuchwepheshe obuphezulu: Unxibelelwano lwe-microwave, iinkqubo ze-laser, kunye nezixhobo zokuqhuba iisemiconductor.
Ngaphaya kokuvelisa, i-HLW ibonelela ngenkxaso epheleleyo, equka ukucebisana kwe-injiniyering ukuphucula uyilo lwezixhobo ukuze ziveliseke lula, ukuncitshiswa kweendleko, kunye nokuhamba kakuhle komsebenzi. Iziko lenkampani elingaphezu kwee-square foot ezingama-28,000 lixhotyiswe ngomatshini ongaphezu kwama-40 wokugaya nokujika, i-gantry mills, kunye nezixhobo zokuhlola eziphucukileyo, nto leyo eyenza ukuba ikwazi ukuphatha iiprojekthi zazo zonke iisayizi—ukusuka kwizixhobo ezincinci ze-thermoplastic ukuya kwii-plate zentsimbi ezinkulu. I-HLW ikwabonelela ngezisombululo zoluhlu lwethuba lokuhambisa, ezifana nolawulo lwempahla esitokweni kunye nokuhanjiswa okukhawulezisiweyo ukuhlangabezana nexesha elibekiweyo eliqatha lishishini le-semiconductor.
Ikamva loMatshini we-CNC we-Semiconductor
Njengoko iitekhnoloji ze-semiconductor zihamba phambili, imfuno yezixhobo ezincinci kakhulu, ezisebenza kakhulu nezinezakhiwo ezintsonkothileyo iyaqhubeka nokukhula. I-HLW iphambili kolu hlaziyo, yamkela iindlela ezifana nolawulo lweeprojekthi oluncediswa yi-AI, imveliso ezenzekelayo, kunye nokudityaniswa kwezinto ezingaqhelekanga. Ugxininiso lwenkampani ekuphuculeni iinkqubo, ukusebenza kakuhle, kunye nobuchule obukhethekileyo kwizinto zokwakha kuqinisekisa ukuba iyakwazi ukuhlangabezana neemfuno zeshishini ezitshintshayo—ukusuka kumathuba okunyamezela aphantsi ukuya kuyilo lwezixhobo olutsha.
Ukufumana izisombululo zokwenziwa kwe-semiconductor nge-CNC ezenzelwe wena ezidibanisa ukuchaneka, ukuthembeka, kunye nobuchule, qhagamshelana ne-HLW kule nombolo 18664342076 okanye kule imeyile info@helanwangsf.com. Nokuba ufuna i-prototyping, imveliso enomthamo ophantsi, okanye imveliso enomthamo ophezulu, i-HLW liqabane lakho elithembekileyo ekunikezeleni ngamalungu e-semiconductor akumgangatho ophezulu.